Jin, Yufeng

Professor

Research Interests: MEMS, 3D integration

Office Phone: 86-10-6276 6591

Email: yfjin@pku.edu.cn

Jin, Yufeng is a professor in the Department of Microelectronics, School of EECS, and he received his B.E in 1982 and M.E in 1985 from Nanjing Institute of Technology, PhD on physical and optical-electronics engineering from Southeast University, China, in 1999. Since then, he worked as a post-doctor, associated professor and professor in Peking University. He worked in Joining Group of GINTIC/SIMTech as a visiting research fellow from Nov., 2001 to Oct., 2004. He has directed National Key Laboratory of Science and Technology on Micro/Nano Fabrication since 2005. His research interests focus on MEMS sensors, TSV related 3D integration of microsystems and its application systems. .

Dr. Jin has been granted about 30 patents, published 4 books and more than 80 research papers, and part of them are published in top-tier conferences or journals, such as ECTC, ESTC, EPTC, ICEPT, MEMS, Transducers, and EDL in the past 10 years. He has served in the Technical Program Committee of various international conferences including EPTC, ICEPT, CSMNT and MTT-S. He was also in the Editorial Board of Journal of Microelectronics and Electronic Packaging (2013-2016). He was awarded 1st Award of Technology Innovation from Beijing City in 2002, 1st Award of Science and Technology Progress from Ministry of Education in 2009 and 2016, respectively.

Dr. Jin was projects manager of more than 20 research projects including NSFC, 973 programs, 863 project, etc. His research achievements are summarized as follows:

1. MEMS techniques: Si-based micro/nano fabrication has been widely applied in many fields such as mobile phone and vehicle products. He proposed novel vacuum packaging method for hermetical sealing and film getter for maintenance low pressure in small cavity for MEMS packaging. He also proposed a panel level MEMS packaging and integration on advanced LTCC substrate. His group developed MEMS based micro sensors for radiation detection applied in the space activity and anti-terrorism in the cities.

2. 3D integration: to improve functional density of integration, TSV 3D integration has been introduced, and shown promising progresses recent year. He and his group conducted design and simulation of 3D module, process development and packaging/testing of multi-layer chip/wafer, such as 10 layer SRAM stacking prototype. More than 20 patents on this field has been granted in the past ten years. His 3D SiP group has established close relationship with INTEL, SAMSUNG, SIMTech, HUAWEI, SMIC, ASTRI, CETC, etc on development of 3D integration technologies.